Electrothermal Monte Carlo Simulations of InGaAs/AlGaAs HEMTs

N.J. Pilgrim, W. Batty, R.W. Kelsall

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Results from the application of our electrothermal simulator to n-type 0.15 µm gate In0.15Ga0.85As-Al0.28Ga0.72As HEMT structures are presented. The simulator involves an iterative procedure which alternately solves the Heat Diffusion Equation (HDE) and executes a Monte Carlo electronic transport algorithm. The net thermal flux generated during each Monte Carlo stage, calculated from the net rate of phonon emission, is fed into the thermal solution; the resulting temperature map is then used in the following Monte Carlo iteration. The HDE is solved through application of a novel analytical thermal resistance matrix technique which allows calculation of temperatures solely within the region of interest while including the large-scale boundary conditions. A novel charge injection scheme is applied for the treatment of side ohmic contacts, which avoids anomalous generation of thermal flux in adjacent regions. The characteristic 'thermal droop' is found in the I-V characteristics of the simulated device. Associated temperature distributions are shown to be spatially non-uniform with peak values and spatial locations dependent upon bias and the length of the containing die. Electron drift velocities and energies along the HEMT channel exhibit the largest shift on the inclusion of thermal self-consistency below the drain end of the gate, not at the location of the temperature peak.

Original languageEnglish
Pages (from-to)207-211
Number of pages5
JournalJournal of Computational Electronics
Volume2
Issue number2-4
DOIs
Publication statusPublished - Dec 2003

Fingerprint

InGaAs
High electron mobility transistors
high electron mobility transistors
aluminum gallium arsenides
Monte Carlo Simulation
simulators
Heat Diffusion
heat
simulation
Diffusion equation
Heat Equation
thermal resistance
Simulator
iteration
temperature
electric contacts
temperature distribution
Self-consistency
Thermal Resistance
inclusions

Cite this

Electrothermal Monte Carlo Simulations of InGaAs/AlGaAs HEMTs. / Pilgrim, N.J.; Batty, W.; Kelsall, R.W.

In: Journal of Computational Electronics, Vol. 2, No. 2-4, 12.2003, p. 207-211.

Research output: Contribution to journalArticle

Pilgrim, N.J. ; Batty, W. ; Kelsall, R.W. / Electrothermal Monte Carlo Simulations of InGaAs/AlGaAs HEMTs. In: Journal of Computational Electronics. 2003 ; Vol. 2, No. 2-4. pp. 207-211.
@article{2b17b6f026424d879aa1841505fb289e,
title = "Electrothermal Monte Carlo Simulations of InGaAs/AlGaAs HEMTs",
abstract = "Results from the application of our electrothermal simulator to n-type 0.15 µm gate In0.15Ga0.85As-Al0.28Ga0.72As HEMT structures are presented. The simulator involves an iterative procedure which alternately solves the Heat Diffusion Equation (HDE) and executes a Monte Carlo electronic transport algorithm. The net thermal flux generated during each Monte Carlo stage, calculated from the net rate of phonon emission, is fed into the thermal solution; the resulting temperature map is then used in the following Monte Carlo iteration. The HDE is solved through application of a novel analytical thermal resistance matrix technique which allows calculation of temperatures solely within the region of interest while including the large-scale boundary conditions. A novel charge injection scheme is applied for the treatment of side ohmic contacts, which avoids anomalous generation of thermal flux in adjacent regions. The characteristic 'thermal droop' is found in the I-V characteristics of the simulated device. Associated temperature distributions are shown to be spatially non-uniform with peak values and spatial locations dependent upon bias and the length of the containing die. Electron drift velocities and energies along the HEMT channel exhibit the largest shift on the inclusion of thermal self-consistency below the drain end of the gate, not at the location of the temperature peak.",
author = "N.J. Pilgrim and W. Batty and R.W. Kelsall",
year = "2003",
month = "12",
doi = "10.1023/B:JCEL.0000011426.11111.64",
language = "English",
volume = "2",
pages = "207--211",
journal = "Journal of Computational Electronics",
issn = "1569-8025",
publisher = "Springer Netherlands",
number = "2-4",

}

TY - JOUR

T1 - Electrothermal Monte Carlo Simulations of InGaAs/AlGaAs HEMTs

AU - Pilgrim, N.J.

AU - Batty, W.

AU - Kelsall, R.W.

PY - 2003/12

Y1 - 2003/12

N2 - Results from the application of our electrothermal simulator to n-type 0.15 µm gate In0.15Ga0.85As-Al0.28Ga0.72As HEMT structures are presented. The simulator involves an iterative procedure which alternately solves the Heat Diffusion Equation (HDE) and executes a Monte Carlo electronic transport algorithm. The net thermal flux generated during each Monte Carlo stage, calculated from the net rate of phonon emission, is fed into the thermal solution; the resulting temperature map is then used in the following Monte Carlo iteration. The HDE is solved through application of a novel analytical thermal resistance matrix technique which allows calculation of temperatures solely within the region of interest while including the large-scale boundary conditions. A novel charge injection scheme is applied for the treatment of side ohmic contacts, which avoids anomalous generation of thermal flux in adjacent regions. The characteristic 'thermal droop' is found in the I-V characteristics of the simulated device. Associated temperature distributions are shown to be spatially non-uniform with peak values and spatial locations dependent upon bias and the length of the containing die. Electron drift velocities and energies along the HEMT channel exhibit the largest shift on the inclusion of thermal self-consistency below the drain end of the gate, not at the location of the temperature peak.

AB - Results from the application of our electrothermal simulator to n-type 0.15 µm gate In0.15Ga0.85As-Al0.28Ga0.72As HEMT structures are presented. The simulator involves an iterative procedure which alternately solves the Heat Diffusion Equation (HDE) and executes a Monte Carlo electronic transport algorithm. The net thermal flux generated during each Monte Carlo stage, calculated from the net rate of phonon emission, is fed into the thermal solution; the resulting temperature map is then used in the following Monte Carlo iteration. The HDE is solved through application of a novel analytical thermal resistance matrix technique which allows calculation of temperatures solely within the region of interest while including the large-scale boundary conditions. A novel charge injection scheme is applied for the treatment of side ohmic contacts, which avoids anomalous generation of thermal flux in adjacent regions. The characteristic 'thermal droop' is found in the I-V characteristics of the simulated device. Associated temperature distributions are shown to be spatially non-uniform with peak values and spatial locations dependent upon bias and the length of the containing die. Electron drift velocities and energies along the HEMT channel exhibit the largest shift on the inclusion of thermal self-consistency below the drain end of the gate, not at the location of the temperature peak.

U2 - 10.1023/B:JCEL.0000011426.11111.64

DO - 10.1023/B:JCEL.0000011426.11111.64

M3 - Article

VL - 2

SP - 207

EP - 211

JO - Journal of Computational Electronics

JF - Journal of Computational Electronics

SN - 1569-8025

IS - 2-4

ER -