Material removal rate prediction for ultrasonic drilling of hard materials using an impact oscillator approach

M Wiercigroch, R D Neilson, M A Player

Research output: Contribution to journal › Article

59 Citations (Scopus)

Abstract

It is postulated that the main mechanism of the enhancement of material removal rate (MRR) in ultrasonic machining is associated with high amplitudes forces generated by impacts, which act on the workpiece and help to develop micro-cracking in the cutting zone. The inherent non-linearity of the discontinuous impact process is modelled, to generate the pattern of the impact forces. A novel procedure for calculating the MRR is proposed, which for the first time explains the experimentally observed fall in MRR at higher static forces. (C) 1999 Published by Elsevier Science B.V. All rights reserved.

Original languageEnglish
Pages (from-to)91-96
Number of pages6
JournalPhysics Letters A
Volume259
Issue number2
DOIs
Publication statusPublished - 9 Aug 1999

Keywords

  • ultrasonics
  • impact oscillator
  • machining
  • CUTTING PROCESS

Cite this

Material removal rate prediction for ultrasonic drilling of hard materials using an impact oscillator approach. / Wiercigroch, M ; Neilson, R D ; Player, M A .

In: Physics Letters A, Vol. 259, No. 2, 09.08.1999, p. 91-96.

Research output: Contribution to journal › Article

Wiercigroch, M, Neilson, RD & Player, MA 1999, 'Material removal rate prediction for ultrasonic drilling of hard materials using an impact oscillator approach', Physics Letters A, vol. 259, no. 2, pp. 91-96. https://doi.org/10.1016/S0375-9601(99)00416-8
Wiercigroch M, Neilson RD, Player MA. Material removal rate prediction for ultrasonic drilling of hard materials using an impact oscillator approach. Physics Letters A. 1999 Aug 9;259(2):91-96. https://doi.org/10.1016/S0375-9601(99)00416-8
Wiercigroch, M ; Neilson, R D ; Player, M A . / Material removal rate prediction for ultrasonic drilling of hard materials using an impact oscillator approach. In: Physics Letters A. 1999 ; Vol. 259, No. 2. pp. 91-96.
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