Numerical simulation of the edge stress singularity and the adhesion strength for compliant mushroom fibrils adhered to rigid substrates

R. G. Balijepalli, M. R. Begley, N. A. Fleck, R. M. McMeeking, E. Arzt*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

64 Citations (Scopus)
10 Downloads (Pure)

Fingerprint

Dive into the research topics of 'Numerical simulation of the edge stress singularity and the adhesion strength for compliant mushroom fibrils adhered to rigid substrates'. Together they form a unique fingerprint.

Mathematics

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds