Stress analysis of cracked MMCs with Lamellar microstructure

M. Kashtalyan, Y. Sinchuk, R. Piat

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Stress fields in a single-domain sample of MMC containing multiple cracks in the ceramic layer are investigated using a direct analytical method and finite element modeling.

Original languageEnglish
Pages (from-to)345-348
Number of pages4
JournalKey Engineering Materials
Volume627
Early online dateSept 2014
DOIs
Publication statusPublished - 2015

Keywords

  • Analytical modeling
  • Damage modelling
  • Finite element modeling
  • Metal-matrix composites
  • Transverse cracking

Fingerprint

Dive into the research topics of 'Stress analysis of cracked MMCs with Lamellar microstructure'. Together they form a unique fingerprint.

Cite this