Stress analysis of cracked MMCs with Lamellar microstructure

M. Kashtalyan, Y. Sinchuk, R. Piat

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Stress fields in a single-domain sample of MMC containing multiple cracks in the ceramic layer are investigated using a direct analytical method and finite element modeling.

Original languageEnglish
Pages (from-to)345-348
Number of pages4
JournalKey Engineering Materials
Volume627
Early online dateSep 2014
DOIs
Publication statusPublished - 2015

Fingerprint

Stress analysis
Cracks
Microstructure

Keywords

  • Analytical modeling
  • Damage modelling
  • Finite element modeling
  • Metal-matrix composites
  • Transverse cracking

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Stress analysis of cracked MMCs with Lamellar microstructure. / Kashtalyan, M.; Sinchuk, Y.; Piat, R.

In: Key Engineering Materials, Vol. 627, 2015, p. 345-348.

Research output: Contribution to journalArticle

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