Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature

H. Savaloni, G. R. Moradi, Michael Antony Player

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s(-1), for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin(2) psi technique. The components of the stress tensor were obtained using measurements at three different phi angles of 0 degrees, 45 degrees and 90 degrees. The crystallite sizes as a function of substrate temperature and phi angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with phi angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed. (c) 2004 Elsevier Ltd. All rights reserved.

Original languageEnglish
Pages (from-to)245-257
Number of pages12
JournalVacuum
Volume77
Issue number3
DOIs
Publication statusPublished - Feb 2005

Keywords

  • residual stress
  • stress tenser
  • X-ray diffraction
  • texture
  • pole figures
  • X-RAY-DIFFRACTION
  • DEPOSITED ERBIUM FILMS
  • THIN-FILMS
  • GRAIN-STRUCTURE
  • METALLIC-FILMS
  • CU
  • ORIENTATION
  • TOPOGRAPHY
  • STRAINS
  • SURFACE

Cite this

Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature. / Savaloni, H.; Moradi, G. R.; Player, Michael Antony.

In: Vacuum, Vol. 77, No. 3, 02.2005, p. 245-257.

Research output: Contribution to journalArticle

@article{b0eaa0fdd3e14809b24d491459aa9c54,
title = "Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature",
abstract = "Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s(-1), for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin(2) psi technique. The components of the stress tensor were obtained using measurements at three different phi angles of 0 degrees, 45 degrees and 90 degrees. The crystallite sizes as a function of substrate temperature and phi angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with phi angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed. (c) 2004 Elsevier Ltd. All rights reserved.",
keywords = "residual stress, stress tenser, X-ray diffraction, texture, pole figures, X-RAY-DIFFRACTION, DEPOSITED ERBIUM FILMS, THIN-FILMS, GRAIN-STRUCTURE, METALLIC-FILMS, CU, ORIENTATION, TOPOGRAPHY, STRAINS, SURFACE",
author = "H. Savaloni and Moradi, {G. R.} and Player, {Michael Antony}",
year = "2005",
month = "2",
doi = "10.1016/j.vacuum.2004.10.001",
language = "English",
volume = "77",
pages = "245--257",
journal = "Vacuum",
issn = "0042-207X",
publisher = "Elsevier Limited",
number = "3",

}

TY - JOUR

T1 - Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature

AU - Savaloni, H.

AU - Moradi, G. R.

AU - Player, Michael Antony

PY - 2005/2

Y1 - 2005/2

N2 - Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s(-1), for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin(2) psi technique. The components of the stress tensor were obtained using measurements at three different phi angles of 0 degrees, 45 degrees and 90 degrees. The crystallite sizes as a function of substrate temperature and phi angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with phi angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed. (c) 2004 Elsevier Ltd. All rights reserved.

AB - Pole figures were collected for silver films of 140 nm thickness deposited on glass substrates with deposition rate of 0.076 nm s(-1), for substrate temperatures between 300 and 600 K covering all three zones in the structure zone model (SZM), using an X-ray diffractometer in texture mode. Additional information for determination of residual stress in these films was obtained by the sin(2) psi technique. The components of the stress tensor were obtained using measurements at three different phi angles of 0 degrees, 45 degrees and 90 degrees. The crystallite sizes as a function of substrate temperature and phi angle were also obtained, and showed, an increase with substrate temperature in agreement with the SZM predictions, and a decrease with phi angle, possibly due to some correlation between the preferred orientation and grain size. The relation between stress in these films and the processes of film growth in the SZM is discussed. (c) 2004 Elsevier Ltd. All rights reserved.

KW - residual stress

KW - stress tenser

KW - X-ray diffraction

KW - texture

KW - pole figures

KW - X-RAY-DIFFRACTION

KW - DEPOSITED ERBIUM FILMS

KW - THIN-FILMS

KW - GRAIN-STRUCTURE

KW - METALLIC-FILMS

KW - CU

KW - ORIENTATION

KW - TOPOGRAPHY

KW - STRAINS

KW - SURFACE

U2 - 10.1016/j.vacuum.2004.10.001

DO - 10.1016/j.vacuum.2004.10.001

M3 - Article

VL - 77

SP - 245

EP - 257

JO - Vacuum

JF - Vacuum

SN - 0042-207X

IS - 3

ER -